Morning Overview on MSN

True 3D chip stacking could pack far more computing into the same footprint

A coalition of researchers from Stanford, Carnegie Mellon, the University of Pennsylvania, and MIT has demonstrated ...
IEEE

Ultrawideband, Dual-Polarized, High-Isolation Conformal Phase Array: Design and Implementation

Abstract: A novel design and implementation of ultrawideband dual-polarized cylindrical conformal phased array is presented with high isolation. Compared to the single-polarized counterpart, the ...
Morning Overview on MSN

Researchers just crammed more computing into the same chip space by stacking silicon circuits in multiple layers — a vertical stack that squeezes whole generations …

For decades, chipmakers squeezed more transistors onto processors by shrinking them sideways. That playbook is running out of ...
IEEE

Hybrid TDOA/DOA Multiple PD Localization Using Two Arrays With KPCA-mnc-FastICA and Sparrow Search Algorithm

Abstract: Time difference of arrival (TDOA) and direction of arrival (DOA) are, respectively, applied to detect partial discharge (PD) target with ultrasonic signal. The reason why these two methods ...
ZDNet

96% of IT pros use AI now: Their top 7 agentic applications and biggest implementation roadblocks

I wore the world's first HDR10 smart glasses TCL's new E Ink tablet beats the Remarkable and Kindle Anker's new charger is one of the most unique I've ever seen Best laptop cooling pads Best flip ...