Ubitium, a German semiconductor start-up, announced the tape-out of its first silicon on Samsung Foundry's 8nm process. The tape-out was completed in December 2025. The chip is the first universal ...

Multi-die design using 2.5D and 3D technologies has emerged as a necessity to keep the pace of innovation. For all their benefits, these projects present new challenges. This post considers monitoring ...

Researchers have developed a microscopic 3D-printed optical device that can efficiently combine light from dozens of small semiconductor lasers into a single multimode optical fiber with very low loss ...

What has changed between UCIe 2.0 and UCIe 3.0? Why UCIe matters for enabling next-generation chiplet architectures. Where the semiconductor industry goes next in its chiplet ambitions. The Universal ...