The Next Computing Revolution May Come From Stacking Chips Like Skyscrapers

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

Twisted stacking lets 2D conductor keep single-layer performance in bulk form

Two-dimensional (2D) materials, which are significantly thinner than a single sheet of paper, have long drawn attention for ...

'All-in-one' platform developed for multiple trait stacking in crops

A major goal of modern crop breeding is to efficiently combine multiple desirable traits by "stacking" the favorable gene ...
Morning Overview on MSN

True 3D chip stacking could pack far more computing into the same footprint

A coalition of researchers from Stanford, Carnegie Mellon, the University of Pennsylvania, and MIT has demonstrated ...
IEEE

Ultrawideband, Dual-Polarized, High-Isolation Conformal Phase Array: Design and Implementation

Abstract: A novel design and implementation of ultrawideband dual-polarized cylindrical conformal phased array is presented with high isolation. Compared to the single-polarized counterpart, the ...

Microsoft bets on AI agents, not apps, and dynamic UI with Project Solara

Project Solara rethinks computing with AI agents replacing apps, dynamic interfaces adapting in real time, and hardware ...
IEEE

Hybrid TDOA/DOA Multiple PD Localization Using Two Arrays With KPCA-mnc-FastICA and Sparrow Search Algorithm

Abstract: Time difference of arrival (TDOA) and direction of arrival (DOA) are, respectively, applied to detect partial discharge (PD) target with ultrasonic signal. The reason why these two methods ...
ZDNet

96% of IT pros use AI now: Their top 7 agentic applications and biggest implementation roadblocks

I wore the world's first HDR10 smart glasses TCL's new E Ink tablet beats the Remarkable and Kindle Anker's new charger is one of the most unique I've ever seen Best laptop cooling pads Best flip ...